Capabilities2018-12-04T09:28:55+00:00

Capabilities

Design for Manufacture

Specificationmminches
Minimum Track & Gap0.10.004
Minimum Annular Ring0.10.004
Minimum Inner Layer Clearance0.2540.01
Minimum Feature to Profile0.10.004

Drilling / Routing

Aspect Ratio 8:1

Specificationmminches
Minimum Hole Diameter (Drilled)0.20.008
Minimum Hole Diameter (Finished)0.10.004
Minimum Slot (Diameter)0.50.019
Hole Tolerance0.050.002
Routing Tolerance+/- 0.1+/- 0.004

Surface Finish

  • E.N.I.G: 3-5um Nickel¬†0.05-0.1um Gold
  • Immersion Silver
  • Lead-Free H.A.S.L: SN100C
  • Hard Gold (Edge Connectors): 2.5um Minimum
  • Immersion Tin

Other Surface are available on request

Soldermask

Green (Standard) Blue Black Red White

Specificationmminches
Minimum Soldermask Clearance0.080.003

Silkscreen

White (Standard) Black Yellow

Specificationmminches
Minimum Silkscreen Feature0.1250.005

Maximum Board Dimensions

Specificationmminches
Single Sided560 x 30522 x 12
Plated Through Hole (PTH)560 x 30522 x 12
Multilayer381 x 26015 x 10.25
Flex-Rigid381 x 26015 x 10.25
Flexible381 x 26015 x 10.25

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