Capabilities
Design for Manufacture
| Specification | mm | inches |
|---|---|---|
| Minimum Track & Gap | 0.1 | 0.004 |
| Minimum Annular Ring | 0.1 | 0.004 |
| Minimum Inner Layer Clearance | 0.254 | 0.01 |
| Minimum Feature to Profile | 0.1 | 0.004 |
Drilling / Routing
Aspect Ratio 8:1
| Specification | mm | inches |
|---|---|---|
| Minimum Hole Diameter (Drilled) | 0.2 | 0.008 |
| Minimum Hole Diameter (Finished) | 0.1 | 0.004 |
| Minimum Slot (Diameter) | 0.5 | 0.019 |
| Hole Tolerance | 0.05 | 0.002 |
| Routing Tolerance | +/- 0.1 | +/- 0.004 |
Surface Finish
- E.N.I.G: 3-5um Nickel 0.05-0.1um Gold
- Immersion Silver
- Lead-Free H.A.S.L: SN100C
- Hard Gold (Edge Connectors): 2.5um Minimum
- Immersion Tin
Other Surface are available on request
Soldermask
Green (Standard) Blue Black Red White
| Specification | mm | inches |
|---|---|---|
| Minimum Soldermask Clearance | 0.08 | 0.003 |
Silkscreen
White (Standard) Black Yellow
| Specification | mm | inches |
|---|---|---|
| Minimum Silkscreen Feature | 0.125 | 0.005 |
Maximum Board Dimensions
| Specification | mm | inches |
|---|---|---|
| Single Sided | 560 x 305 | 22 x 12 |
| Plated Through Hole (PTH) | 560 x 305 | 22 x 12 |
| Multilayer | 381 x 260 | 15 x 10.25 |
| Flex-Rigid | 381 x 260 | 15 x 10.25 |
| Flexible | 381 x 260 | 15 x 10.25 |
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